Potting Compounds & Encapsulants

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Potting Compounds and Encapsulants are liquid compound-based resin systems designed to be poured over electrical equipment. They are a crucial part in many different electrical applications and can aid with insulation, moisture resistance, shock and vibration resistance, and much more. These compounds help to extend the lifespan of electronics by ensuring increased durability and reliability overtime.

  • Potting: The potting method is when an electronic device is placed inside of a case or shell then covered completely by liquid compound from the top. This is the most common method because it produces quick results.  
  • Encapsulating: The encapsulation method, also know as dip coating, requires that the entire device be dipped into the liquid compound.
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